Cu – Interconnects, Glass, and AI – Assisted Simulation for Chiplets and Heterogeneous Integration | 72.84 MB
Title: Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
Author: John Lau, Xuejun Fan
Category: Nonfiction, Science & Nature, Science, Physics, Solid State Physics, Technology, Electronics, Circuits
Language: English | 566 Pages | ISBN: 9789819641666
Nano-Glass Ceramics Processing, Properties and Applications | 3.42 MB
Title: Nano-Glass Ceramics
Author: Marghussian, Vahak;
Category: Nonfiction, Science & Nature, Technology, Electronics, Semiconductors, Material Science
Language: English | 293 Pages | ISBN: 032335386X